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Theory and Fabrication of Integrated Circuits
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LDS Thermal Evaporator

Description Operation 3D Drawings Oops...

The LDS 18-7211 Thermal Evaporator System was designed and built in the Spring 2003 semester to supplement the Cooke 301, which can only do a limited number of wafers with unpredictable metal thickness results. The 7211 was custom-built specifically for the ECE444 laboratory by Leon Schneider and Dane Sievers .

Cooke LDS
Bell Jar Diameter 12" 18" 
Bell Jar Material glass stainless steel
Number of filaments 2 2
Filament type W (tungsten) coil W (tungsten) boat
Filament PS variac Concordia
Number of wafers/run 8 x 2"/2 x 4" 9 x 4"
Hi Vac Valve 2" butterfly 160mm gate
Roughing pump Sargent-Welch Duo-Seal 1402 Alcatel 2033
Roughing pump speed 5.6 cfm 53.7 cfm
Hi vac pump 2" diffusion pump Leybold TMP1000C
Hi vac pump speed 325 l/s ~900 l/s
Low vac gage 2 TCs 2 Convectron
Hi vac gage cold cathode inverted magnetron cold cathode
Ultimate pressure 1 x 10-5 Torr 5 x 10-8 Torr

Process Equipment

· Gaertner Ellipsometer

· Evaporator (CVE)

· Evaporator (LDS)

· Filmetrics FT-20

· Prometrix FT650

· Four Point Probe (LDS)

· Four Point Probe (Veeco)

· Furnace

· Plasma Asher

· Spin-Rinse-Dryer

· Stepper (Nikon)

· Stepper (Ultratech)

· Probe Stations


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