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	ece444 Theory and Fabrication of Integrated Circuits

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Material Safety Data Sheets

IC fabrication utilizes many aggressive chemicals. It is the responsibility of the workers in the lab to have an understanding of what these chemicals can do and how to safely handle them.

Chemicals Used in ECE444

H₂SO₄ - sulfuric acid
HCl - hydrochloric acid
6:1 BOE - buffered oxide etch
HNO₃ - nitric acid
HF - hydrofluoric acid
H₃PO₄ - ortho-phosphoric acid
NH₄OH - ammonium hydroxide
NH₄F - ammonium fluoride
H₂O₂ - hydrogen peroxide
HMDS - hexamethyldisilazane
(CH₃)₂CO - Acetone
IPA - isopropyl alcohol
Shipley 1813 photoresist
Shipley MF-319 Developer
Saint Gobain BN975 PDS - boron nitride solid diffusion source
Saint Gobain PH1025 PDS - phosphorus solid diffusion source

DRS MSDSs

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Lab Safety

·MSDSs

·Personal Protective Equipment

·Power Outage

·Safety Handout

In case of emergency, always call 9-911 and give the following information:

·Your name

·Location:
ECE444 Fabrication Laboratory
Room 260
2nd Floor MNTL
208 N. Wright St.

·Specific information about the emergency

Answers provided by this service may not be relevant to the materials presented in this website.

Department of Electrical and Computer Engineering
College of Engineering
University of Illinois Urbana-Champaign