Level 3 Photoresist Removal
This step removes photoresist to prevent contamination of furnaces.
- Solvent waste container
three 15 second acetone rinses
min plasma ash
- Solvent fume hood
PR, acetone, and ipa are volatile and flammable. Keep away from flame. Possible
biological hazards: only use in a fume hood.
- Initial PR Removal: Hold your wafer level over the waste acetone/IPA container (with
the lid off) and squirt acetone on the wafer until it begins to flow off the edges.
Let it dissolve the PR for 10-15 seconds before tossing the acetone into the waste
container. Repeat until most of the PR is gone (~3 times).
- Strip off any remaining PR residue by following the standard degreasing procedure
(Acetone, IPA, DI, IPA, N2 dry.)
- Inspect the wafer under a microscope for PR residue. Go back and degrease
Incomplete photoresist removal is the most common cause of furnace tube contamination.
Please inspect wafers thoroughly.
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